Chip-On-Flex (COF) Market is experiencing a fast growth across the globe. Chip-on-Flex is a kind of COB or Chip-on-Board process technology. The fundamental of chip-on-board process technology includes attaching a chip or a die in a place and a wire bonding it straight to the substrate metallization. The process is affordable and also significantly improves footprint efficiency and lead time. Chip-on-Flex held with shorter interconnection paths simplifies the process of manufacturing and designing of the product and also thereby improves its performance. The rising need for flexible electronics in different applications such as sensors, displays, radio frequency identification and biomedical implants are the major factors driving the growth of chip-on-flex market. Moreover, some important features of chip-on-flex which includes component assembly, heat sinks, penalization, over molding, shielding and gravity overlay have made the product more demanding among end-users such as aerospace, defense, electronic and others. Moreover, increasing investment in research & development sector to progress in displays or screens to have more better quality, more durability and cost efficient are the major factor to boost the growth of chip-on-flex market during the projection period.
Single sided chip-on-flex has numerous benefits which includes stronger signal quality, reduced wiring errors, design flexibility and stronger signal quality. Wide use of single sided Chip-On-Flex (COF) Market in various applications including industrial, automotive and aerospace sectors makes the market more demanding. Moreover, increasing demand of COF in developing countries present in the Asia-Pacific region such as India, China creates a positive impact on the chip-on-flex market growth. Apart from this China, Japan, and few other countries being the hub for large area display manufacturers creates a high demand of chip-on-flex in these regions. Further down, technological advancement also leads to automated production and accurate designs which helps to abolish human errors. Use of chip-on-flex helps in improving operator ergonomics, reducing the cost and amplified product quality which in turn augments the market growth of this product during the forecasted years.
Major application of chip-on-flex mentioned in report includes static and dynamic. The chip-on-flex market in report is segmented by type which includes single sided COF and others.Moreover, on the basis of end-use the market has been segmented into aerospace, military, defense, and medical. The global chip-on-flex (COF) market has been moreover segmented geographically into North America, Europe, Asia-Pacific, Middle East and Africa and Latin America.
Technological advancement and creativity by leading vendors has made the market more demanding across the globe. Moreover, risingneed for flexible electronics in several applications such as lighting, sensors, radio frequency identification, displays and others, creates a high growth opportunity of this market during the period 2017-2025.
Some of the major players in the global chip-on-flex market are AKM Industrial, Shenzhen Danbond Technology Co. Ltd., Flexceed Co. Ltd., Finetech and others.
Global Chip-On-Flex (COF) Market: By Type
Global Chip-On-Flex Market: By Application
Global Chip-On-Flex Market: By End-Use
Global Chip-On-Flex (COF) Market: By Geography
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